Specifications | Tin Plating at Tyco Electronics RoHS, tin plating, lead free, plating, tin Bob Hilty |
Business section |

Specifications | Tin Plating at Tyco Electronics RoHS, tin plating, lead free, plating, tin Bob Hilty |
Business section |
Specifications | Tin Plating at Tyco Electronics RoHS, tin plating, lead free, plating, tin Bob Hilty |
Outline | 503_1012_tin plating strategy.pdf Once a plating process has been approved, the same plating process may be used at other locations within Tyco Electronics and at our suppliers. The plating process is documented, including the chemistry of the plating process and all process control parameters. These specifications are shared (under confidentiality agreement) with our suppliers. Each plating plant that provides lead free tin plating to Tyco must adhere to these practices. For initial installations, the plant must provide a sample of plated product to Tyco Electronics for inspection and analysis. X-ray diffraction is used to characterize the crystallographic morphology of the plating and compare the orientation to known good samples on file. Known good samples are those samples that have already successfully passed the JEDEC tin whisker test. Since the crystal orientation can change is the process parameters are not followed, this test provides assurance that the process is operating according to specification. Audits of the plating plants further ensure compliance to the specification. Conclusions |
Suggested Link Details/Purchase | |
Content | 503-1012 30JUN06 2 Introduction: Lead free electronic manufacturing has been mandated by several directives from the European Union.1 The impact of conversions required to meet these directives has been far reaching and has real impacts on the process yields, availability and performance of these products. At Tyco Electronics, we manufacture an enormous variety of passive electronics components. Previously, many of these products had used tin/lead plating as a contact interface material or in the solderable interface. In previous publications we reviewed the reasons for selecting pure tin2 as the replacement for tin/lead and the general issue of tin whiskers.3, 4 5 This document provides information about the use of tin plating at Tyco Electronics, our qualification process, performance of tin platings and our strategy for conversions. Typical Tin Platings at Tyco Electronics: For passive electronic components, the biggest challenge for RoHS compliance is the elimination of lead from the plating process. In the past we plated tin/lead alloys, typically with a lead content of 7% by weight. The platings were either bright or matte finishes. Bright finishes have a submicron grain size and are generally reflective. Matte finishes have grain sizes in excess of 1 μm and are dull or non-reflective in appearance. Connector products typically include multiple regions which have different functional requirements. Table 1 shows the common regions in connector products and the plating finishes that are normally used in those regions. Table 1. Table of connector finish methods Contact Element Underplating Traditional finish platings RoHS compliant finish platings Separable interface Nickel (1.3μm) Gold, gold flashed palladium nickel, silver, tin/lead (bright and matte), tin (bright and matte), hot tin dip Gold, gold flashed palladium nickel, silver, tin (bright and matte), hot tin dip Crimp Nickel (1.3μm) Typically tin/lead or tin, hot tin dip Typically tin, hot tin dip Insulation displacement Nickel (1.3μm) Typically tin/lead or tin Typically tin Press-fit contact Nickel (1.3μm) Typically tin/lead or tin, limited use of gold Typically tin; tin/lead still offered as a RoHS compliant finish Solder tail Nickel (1.3μm) Typically tin/lead or tin Typically tin A key observation from Table 1 is that nickel underplating is used on most products. Examples of connector products are shown in Figure 1. These products are |
Navigation | Previous Page / Next Page |
Following Datasheets | tm_5 (1 pages) TMT_Whitepaper (7 pages) tn8000_35 (3 pages) tn8722_01_us (24 pages) TorontoCA_CaseStudy_1 (5 pages) toronto_location_2 (1 pages) tosemi_5 (3 pages) tosemi_120910 (2 pages) tr1pc_cd (1 pages) tr2a_cd (1 pages) |
Check in e-portals![]() |
World-H-News Products Extensions Partners Automation Jet Parts |
Sitemap Folder | group1 group2 group3 group4 group5 group6 group7 group8 group9 group10 group11 group12 group13 group14 group15 group16 group17 group18 group19 group20 group21 group22 group23 group24 group25 group26 group27 group28 group29 group30 group31 group32 group33 group34 group35 group36 group37 group38 group39 group40 group41 group42 group43 group44 group45 group46 group47 group48 group49 group50 group51 group52 group53 group54 group55 group56 group57 group58 group59 group60 group61 group62 group63 group64 group65 group66 group67 group68 group69 group70 group71 group72 group73 group74 group75 group76 group77 group78 group79 group80 group81 group82 group83 group84 group85 group86 group87 group88 group89 group90 group91 group92 group93 group94 group95 group96 group97 group98 group99 group100 Prewious Folder Next Folder |