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FOR IMMEDIATE RELEASE, CO794 June 28, 2005 For more information, contact: Jerry Seams, Applications Manager IRC, Inc. 361-992

Specifications
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Content	FOR IMMEDIATE RELEASE, CO794 June 28, 2005 For more information, contact: Jerry Seams, Applications Manager IRC, Inc. 361-992-7900 seamsj@irctt.com Beth Polizzotto, BtB Marketing 919-872-8172 bpolizzotto@btbmarketing.com BGA termination network improves noise immunity, reduces parasitics… IRC’S CHIPSCALE THEVENIN TERMINATION NETWORKS IMPROVE SIGNAL INTEGRITY IN HIGH SPEED DIGITAL CIRCUITS CORPUS CHRISTI, TX (June 28, 2005) — Providing design engineers with a high- density resistor network for terminating signal lines in high speed digital circuits, TT electronics IRC Advanced Film Division recently developed a chipscale Thevenin termination network. Designated part of the CHC Series, the 18-resistor ball grid array network is designed to maximize signal integrity in high-speed digital circuit designs by combining nine Thevenin pairs in a network schematic. According to Jerry Seams, IRC’s Applications Engineering Manager, the Thevenin networks provide superior high speed performance in the termination of digital transmission lines. “In addition to reduced drive requirements and reduced power dissipation, the Thevenin resistive terminators provide both pull-up and pull-down functions for the circuit. Our BGA package eliminates all wire bonds, effectively reducing the internal parasitic inductance of the resistor network to near zero, as well as minimizing external traces on the PC board,” he explained. - more -
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