Thermal Modeling of Aluminum Electrolytic Capacitors Thermal Modeling of Aluminum Electrolytic Capac

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Specifications	Thermal Modeling of Aluminum Electrolytic Capacitors Thermal Modeling of Aluminum Electrolytic Capacitors Sam Parler Cornell Dubilier Electronics Inc.
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12 Presented at the IEEE Industry Applications Society Conference, October 1999 Table VI Modeled Temperatures Various Capacit

Specifications	Thermal Modeling of Aluminum Electrolytic Capacitors Thermal Modeling of Aluminum Electrolytic Capacitors Sam Parler Cornell Dubilier Electronics Inc.
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Content	12 Presented at the IEEE Industry Applications Society Conference, October 1999 Table VI Modeled Temperatures Various Capacitor Constructions ConstructionTcoreTbottomTside P/EP68.154.052.0 NP/EP73.155.052.0 NP/EC61.456.552.5 NP/AR/EC61.256.551.5 P/CW/EP62.253.052.5 NP/CW/EC57.554.052.0 NP/EC/HS54.449.049.0 NP/EP/HS68.452.051.0 NP/EP/CW/HS59.951.551.5 NP/EC/CW/HS56.052.251.0 NP/EC/DB61.056.051.5 NP/EC/DB/DW59.854.552.5 NP/EC/DB/DW/AT58.854.052.0 Legend P=10 W, D=3.0”, L=5.63”, Winding D=2.55”, Ta = 45 ºC, v=2 m/s EC— Extended Cathode EP— Extended Paper HS— Heat Sink aty capacitor bottom, ID=1.2”, OD=3.0”, Theta = 1.0 ºC/W plus 1.0 ºC/W contact resistance CW— Core Winding: Inactive 1.4” inactive diameter (paper and cathode only). Winding OD=2.90” P— Outside of winding is filled completely with pitch NP— Contains no pitch. Outside of winding is empty. AR— Aluminum arbor rod. Diameter = 0.3”. AT— Aluminum top. DW— Double the can wall thickness. DB— Double the can bottom thickness. EP). The core temperature in this case is 73.1 ºC. Adding enough pitch to fill the entire area outside the winding lowers this by 5 ºC, adding 40% to the life. However, a pitchless ex- tended cathode design drops the core an additional 7 ºC to 61.4 ºC. No other construction changes, including doubling the can bottom thickness, wall thickness, arbor rod, etc. are of much help, with the exception of the core winding [13] technique, which allows the pitch/EP design performance to approach that of the pitchless/EC design. Although more expensive than ex- tended cathode and not always feasible due to volume restric- tions, this technique is useful in improving performance in ca- pacitor designs that would normally have empty space around the winding. This space is instead occupied by additional wind- ing area by first winding many “dead” turns of cathode and paper at the beginning of the winding process before introduc- ing the anode. The core winding technique is successful due not as much by having a conductive core as by moving the active, power-generating area outward to an area of larger ra- dius, and by placing the outer area of the winding in closer radial proximity to the can wall. If a core winding is combined with a high-compression extended cathode, the core tempera- ture can be further reduced by 4-5 ºC versus either technique alone. Additional improvement in capacitor performance can be achieved through the use of a heat sink, especially when the capacitor construction is extended cathode, the thermal con- tact is intimate, and the heat sink thermal resistance is low. VIII. CONCLUSIONS We have explored the issues and theory behind thermal mod- eling of aluminum electrolytic capacitors and have developed and presented a model that has simulation and predictive value. REFERENCES [1]Greason, W. D., Critchley, John, “Shelf-life evaluation of aluminum electrolytic capacitors.” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 9, no. 3, September 1986, pp. 293-299. [2]Incropera, F. P., DeWitt, D. P., Introduction to Heat Transfer. John J. Wiley and Sons, New York, 1985, pp. 669-687. [3]Incropera, F. P., DeWitt, D. P., ibid, p. 35. [4]Unattributed, “Aavid Forced Air Thermal Calculator.” Aavid Engineering, Inc., 1987. [5]Eisaian, A., “Air-cooling electronic systems: an introduc- tion.” Electronic Design, December 1997. [6]Hsu, T. H., Engineering Heat Transfer. D. Van Nostrand Company, Inc., Princeton, 1963, p. 269. [7]Lienhard, J. H., A Heat Transfer Textbook. Prentice-Hall, Englewood Cliffs, NJ, 1981, p. 285. [8]Incropera, F. P., DeWitt, D. P., Fundamentals of Mass and Heat Transfer. John J. Wiley and Sons, New York, 1996, p. 371. [9]Gasperi, M. L., Gollhardt, N., “Heat transfer model for capacitor banks.” 33rd Annual Meeting of the IEEE IAS, October 1998. [10]Incropera, F. P., DeWitt, D. P., Introduction to Heat Transfer. John J. Wiley and Sons, New York, 1985, p. 609. [11]Incropera, F. P., DeWitt, D. P., ibid, pp. 403-404. [12]Catalog of Indek Corporation, 1998. [13]Stevens, J. L., Shaffer, J. S., “Modeling and improving heat dissipation from large aluminum electrolytic capaci- tors: II.” 32nd Annual Meeting of the IEEE IAS, Octo- ber 1997, pp. 1046-1051.
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Thermal Modeling of Aluminum Electrolytic Capacitors Thermal Modeling of Aluminum Electrolytic Capacitors Sam Parler Cornell Dubilier Electronics Inc.

Thermal Modeling of Aluminum Electrolytic Capacitors Thermal Modeling of Aluminum Electrolytic Capacitors Sam Parler Cornell Dubilier Electronics Inc.