Specifications | Through Hole Printing Apps Note sherryh |
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Specifications | Through Hole Printing Apps Note sherryh |
Business section |
Specifications | Through Hole Printing Apps Note sherryh |
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Content | Paste in Hole Printing Paste in Hole, Through Hole printing or Intrusive reflow– printing is quickly becoming a cleaner, more effective alternative to wave soldering as a method for connecting through hole components. This note is a quick reference of the many papers written on this subject and outlines the necessary design criteria for successful printing. Board / Component design Correct process designs are very important to the success of through hole printing. If the hole to lead ratio is too large it will require very large stencil apertures, a thick stencil or a large percentage hole fill to obtain an adequate joint. For circular leads the hole diameter should be made approximately 0.012” larger than the pin diameter plus its diameter tolerance, for rectangular pins the hole should be made 0.010” larger than the largest diagonal plus its tolerance. This hole to pin size difference allows for solder paste out-gassing and will help reduce voids. This difference also allows for some placement tolerance for auto- insertion machines. Figure 1:Where X is the maximum diagonal or diameter of the Lead or Pin Other component design criteria that must be considered are that the components must be able to tolerate reflow temperatures between 220o to 235oC, and the components must also have a standoff of at least 0.010” to clear the paste deposit that is printed. Calculation of the required Solder Paste Volume The volume of solder paste, VPaste required is determined by calculating the volume difference between the through hole VHole and the lead, VLead and then accountingfor the part of the paste which shrinks due to the fact that paste is 50% metal by volume. The formula is: ()2 x V-VPasteSolderofVolumeLeadHole= APPLICATIONS NOTE Speedline | MPM 16 Forge Park Franklin, MA 02038-3137 jperault@speedline.cookson.com January 4, 1999 |
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