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| Content | 4200 Bonita PlaceFullerton, California 92807Telephone 714/447-2300FAX 714/447-2400 Example: (From customer)(Produced by BI)(End Customer Product) Thin Film Mother/Daughter Boards Description BI Technologies’ thin film boards are custom ceramic circuit boards for specialty electronic assembly applications. The Thin Film board’s prominent feature is the integration of precision resistors into the layout. These resistors achieve tight tolerances, excellent matching and top temperature characteristics. As a motherboard, Thin Film substrates are compatible with die, chip capacitors, and other surface mountable components. Interfacing is achieved with wire bonding, solder mount and conductive epoxies. Thin Film boards also serve as daughter boards, bringing the critical resistor networks closer to the important ICs. FeaturesApplications Bare die attach with epoxyMilitary Hybrids Gold wire bondableRF Assemblies Integral precision resistorsPrecision Amplification Reduced size and weightSignal Processing High temperature operationMedical/Implantable Solder ready surfaces for flip chips Generating a Design Customer Supplied Design Provide BI with a close approximation of your desired layout. Include overall substrate length and width. Include all resistor tolerance specifics. BI will then estimate pricing. BI will refine resistor layout detail to optimize for our processes. BI Assisted Design Provide a schematic of the resistor network, or complete circuit to be included on the motherboard. Include die sizes and other component dimensions. Provide resistor specification detail. Provide preferred and/or maximum substrate dimensions. BI will do a size estimation of the substrate, and generate pricing. Tooling Costs Tooling costs will be submitted as part of the proposal package. Typical costs include Mask Set, Probe Card and Test Fixture. Design costs will vary depending on level of design support provided. |
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| Following Datasheets | ThinFilmCircuits (6 pages) ThinFilminRF (5 pages) Thin_Film_Update (2 pages) thin_padlay-1 (2 pages) Thin_Wall (3 pages) third_party_not_available (1 pages) thm1-1 (6 pages) thnflmap (2 pages) Thomas_Bus_SAE_Article-1 (2 pages) Thomson_Engineered_Polymers (5 pages) |
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