Thin-film passives in RF/microwave circuits Antonia M. Leverton

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Specifications	Thin-film passives in RF/microwave circuits Antonia M. Leverton
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Thin-film passives in RF/microwave circuits Consistent Q and ESR make thin-film parts an attractive option for design enginee

Specifications	Thin-film passives in RF/microwave circuits Antonia M. Leverton
Outline	Thin-film passives in RF/microwave circuits
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Content	Thin-film passives in RF/microwave circuits Consistent Q and ESR make thin-film parts an attractive option for design engineers BY RON DEMCKO AVX. Myrtle Beach, SC http://www.avx.com Until recently, most microwave capacitors were based on fired multilayer ceramic technology. In this process, layers of highly conductive electrode metal alloys are interleaved with low-loss ceramic dielectrics in a multilayer fashion until the target capacitance is obtained. The resulting stack is then sintered into a monolithic structure in a high-temperature firing process. This process continues to satisfactorily serve high- power capacitor needs in addition to those in larger value RF capacitors. On the flip side, the multilayer ceramic process can potentially exhibit variability on a lot- to-lot and inter-lot basis with regard to parameters important to RF designers. Among these parameters are variations in Q factor, ESR, insulation resistance and capacitance variations over the full-specified tolerance range. Though many applications are not negatively impacted by these variations, breakthroughs in thin-film component manufacturing now offer designers an alternative choice for high-frequency microwave components. The same concepts of thin-film technology used in making semiconductors have allowed the creation of a series of thin-film passive components with extremely tight electrical and physical characteristics. Line width sizes below 1 µm and dielectric layer thicknesses below 100 angstroms are achievable. In addition to the tight parametric tolerances (inductance and capacitance) gained from tight line widths, several other electrical performance advantages can be optimized. Among these are: Extremely consistent ESR on a lot to lot and inter lot basis as a result of high-vacuum- electrode deposition processes.Consistent Q and ESR as a result of ultra-pure, low-K dielectrics deposited in a CVD process.Consistent and predictable impedances across wide frequency ranges.Land Grid Array termination capability to reduce parasitics. The resulting performance advantages of thin-film components can impact a design. In many cases it can reduce the number of components used to achieve a particular circuit function. Not only will the size of the design shrink, but also assembly time and assembly cost decreases while reliability is improved through the use of fewer components. What is more, electrical performance is improved through the use of more electrically consistent parts with lower-loss factors.
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