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Specifications	tycf1d4.tmp Unknown
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EEP-VOL 10-2, Advances in Electronic Packaging ASME 1995 ABSTRACT An analytically ANALYTICAL MODEL FOR SIMULATING THE THERMAL

Specifications	tycf1d4.tmp Unknown
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Content	EEP-VOL 10-2, Advances in Electronic Packaging ASME 1995 ABSTRACT An analytically ANALYTICAL MODEL FOR SIMULATING THE THERMAL BEHAVIOR OF MICROELECTRONIC SYSTEMS P. Teertstra, J.R. Culham and M.M. Yovanovich Microelectronics Heat Transfer Laboratory Department of Mechanical Engineering University of Waterloo Waterloo, Ontario, Canada N2L 3G1 S. Lee Aavid Engineering Ltd. Laconia, NH based model is presented and wall temperatures in for determin- system mod-ing flow velocities ules containing multiple printed circuit boards. The model provides a dynamic blending of two limiting solutions for two-dimensional, free convection channel flow, namely, a fully developed solution and an isolated plate solution. The effects of flow impediments, such as electro-magnetic containment screens, flow deflectors and baffles, on heat transfer within the module are incorporated to provide a better representation of practical applications. The solu- tion procedure includes an implicit formulation for deter- mining the heat transfer between channels based on lo- cal thermophysical characteristics, the contact resist ante between the heat sources and the printed circuit boards, and flow conditions.Results from the analytical mod- els show good agreement with solutions and experimental data published in the open literature for a single channel with an uniform heat flux at each wall. NOMENCLATURE A- b- Cp 9- k- ZKi - L- Pr - n NUL - Nub - q - wall surface area, m 2 channel width, m specific heat, J/kgK gravitational acceleration, m/s 2 thermal conductivity, W/mK inlet, exit loss coefficients channel length, m Prandtl number blending parameter Nusselt number, =– (qL)/(k(Zriaz – ~a)) channel Nusselt number, E (qb)/(k(Znaz – T.)) heat flux, W/m 2 927 Q r1,r2 R Ra~ Ra~ Reb T AT uw x Y heat flow rate, W heat flux ratio for left, right side thermal resistance,= (AT/Q), K/W modified Rayleigh number, s (gPgL4Pr)/(kv2) channel Rayleigh number, s (g@?b5Pr)/(kv2L) channel Reynolds number, s (Zb) /v temperature, K temperature difference, K velocity in primary flow direction, m/s channel depth, m coordinate in primary flow direction, m coordinate normal to the channel wall, m Greek Symbols ;;fs - b~ - P- V P- Subscripts a c efj - f- fd - ap - j- T- 1)2 - thermal diffusivity, m 2 /s volumetric expansion coefficient, K -1 hydraulic boundary layer thickness, m thermal boundary layer thickness, m dynamic viscosity, Ns/m 2 kinematic viscosity, m 2 /s density, kg/m 3 ambient contact effective fluid fully developed isolated plate junction total left and right surfaces Superscripts—average tnon-dimensional value
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Following Datasheets	Thermal-Resistance-Pin-Fin_Heatsinks (8 pages) Thermal-Solutions-Brochure (8 pages) thermal-system_mg (1 pages) thermal (9 pages) thermalapplet-1 (9 pages) thermalbond4949a (4 pages) thermalbond4949b (5 pages) thermalbond4950a (4 pages) thermalbond4950b (5 pages) thermalbond4951a (4 pages)
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