BPaulsen-Olmstead

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Specifications	BPaulsen-Olmstead
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Attributes Data:Gross test results of the various screen- ing steps, such as “ins” and “outs” at the

Specifications	BPaulsen-Olmstead
Suggested Link Details/Purchase
Content	Attributes Data:Gross test results of the various screen- ing steps, such as “ins” and “outs” at the lectrical test points. (see also Variables Data) Baseline:A detailed definition of a device’s electrical and mechanical configuration, assembly, processing, and testing used as a base from which to track subsequent changes. Bond Pull:A destructive test to determine the strength of the bonds. Burn-In:A destructive test to determine the strength of the bonds. Centrifuge (Constant Acceleration):Subjective devices to a G force in a centrifuge for a short duration to test die attach, lead bond, and package integrity. Certificate of Conformance (C of C):A document pro- vided by the manufacturer to confirm that the procured material conforms to all applicable specifications. CSI: Customer Source Inspection (see Source Inspection) Current Density:The amount of current flowing in a conductor per unit area. Data Code: A four-digit number marked on the device which indicates the actual seal week of the package. Delta:The amount an electrical parameter shifts during burn-in or op-life. Pre- and post-stress measurements are taken and the difference between them is compared with an allowable Delta Limit. Die Shear:A test to insure die attach integrity by mea- suring the force required to shear the die off the package base. DPA (Destructive Physical Analysis):A sample of fin- ished devices which are destroyed by various tests to ensure that the quality standards were met. ESD (Electrostatic Discharge):Discharge of accumulat- ed static current which may cuase device damage. Fine Leak: See Hermiticity Generic Data:Qualification or QCI test data on devices or packaging from a similar product as the device shipped. Group A:QCI tests used to verify compliance to electri- cal qualifications. Group B: QCI tests used to verify process-related con- trols for Class B. Also includes op-life for Class S product. Group C:QCI tests for op-life for Class B product. Group D:QCI tests used to verify package-related quali- ty levels. Group E:QCI radiation tests GSI (Government Source Inspection):See Source Inspection Hermiticity:Leak or seal testing performed on all her- metic packages to verify seal integrity. Inspection Lot:A single lot of devices used for inspec- tion purposes. Internal Visual: Visual inspection of the device prior to seal to ensure that die, wires, and package meet all applicable specifications. Internal Wafer Vapor Content (IWVC): The amount of residual moisture trapped within the package cavity after seal. JAN (Joint Army Navy):The trademark designator used to indicate that a given device has been processes in accordance with a controlled government specification. JAN Class B:Reliablity screening level for use in ground- based or airborne equipment. JAN Class S:Reliability screening level for use in space flight equipment. LAT:Lot Acceptance Test Lead Fatigue (Lead Integrity):Application of a repeti- tive bending force to the leads of a device to ensure structural integrity of the leads and package. Lid Torque:A test to ensure the integrity of the seal process and material by twisting the lid and base of the package in opposite directions. Lot Tolerance Percent Defective (LTPD):A single-lot- sampling concept that statistically ensures rejection of 90% of all lots having greater than the specified LTPD. NRADIATIONOWNER’SMANUAL– Processing Capabilities Glossary of Semiconductor Process Flow & Test Terminology
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Following Datasheets	ROM_RHAdocs (6 pages) ROM_SEU (8 pages) ROM_Testing (5 pages) ron_clark_academy (2 pages) Rosin_Core_MSDS_English (4 pages) ROT-100298188CRT-001_3-45-4-45-3_PreTerm (1 pages) ROT-100298188CRT-002_-3-2-1-2-3_PreTerm (1 pages) ROT-100298188CRT-003_-3-1-3_PreTerm (1 pages) ROT-100442985CRT-001_3-2-85-5-5_CMR (1 pages) ROT-100442985CRT-002_2-1-15-5-1_CMR (1 pages)
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