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24-Lead PDIP 0.300” Wide Package Material Declaration Data Sheet Rev. C Page 3 of 3 Material Declaration # 2 Homogeneou

Specifications	Atmel Letterhead wdupey
Outline	Overview Banned Substances Material Declaration # 1 Material Declaration # 2 Comments Disclaimer Information
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Content	24-Lead PDIP 0.300” Wide Package Material Declaration Data Sheet Rev. C Page 3 of 3 Material Declaration # 2 Homogeneous Material Package Material Substance CAS # Weight (g) Percentage ppm Percentage ppm Leadframe Copper (Cu) 7440-50-8 0.4330 97.4 974000 25.33 253300 Iron (Fe) 7439-89-6 0.0111 2.4 24000 0.65 6500 Zinc (Zn) 7440-66-6 0.0004 0.1 1000 0.03 300 Phosphorous (P) 7723-14-0 0.0004 0.1 1000 0.03 300 Sub-Total 0.4449 100.0 1000000 26.04 260400 Integrated Circuit Silicon (Si) 7440-21-3 0.0045 100.0 1000000 0.26 2600 Sub-Total 0.0045 100.0 1000000 0.26 2600 Die Attach Silver (Ag) 7440-22-4 0.0002 76.5 765000 0.01 100 Epoxy Resin Trade Secret 0.0001 18.3 183000 < 0.01 < 100 Curing Agent & Hardener Trade Secret < 0.0001 2.6 26000 < 0.01 < 100 Gamma Butyrolactone 96-48-0 < 0.0001 2.6 26000 < 0.01 < 100 Sub-Total 0.0003 100.0 1000000 0.01 100 Die Pad Plating Silver (Ag) 7440-22-4 0.0006 100.0 1000000 0.03 300 Sub-Total 0.0006 100.0 1000000 0.03 300 Bond Wire Gold (Au) 7440-57-5 0.0004 100.0 1000000 0.03 300 Sub-Total 0.0004 100.0 1000000 0.03 300 Encapsulation Silica Fused 60676-86-0 1.0699 86.5 865000 62.59 625900 Epoxy Resin Trade Secret 0.0680 5.5 55000 3.98 39800 Phenol Resin Trade Secret 0.0680 5.5 55000 3.98 39800 Epoxy, Cresol Novolac 29690-82-2 0.0272 2.2 22000 1.59 15900 Carbon Black 1333-86-4 0.0037 0.3 3000 0.22 2200 Sub-Total 1.2368 100.0 1000000 72.36 723600 Terminal Plating Tin (Sn) 7440-31-5 0.0217 100.0 1000000 1.27 12700 Sub-Total 0.0217 100.0 1000000 1.27 12700 Total 1.7092 100.00 1000000 Comments • Reliability qualification reports are available upon request through the appropriate sales or marketing contact. • Third party testing for RoHS substances has been completed on the homogeneous material level and are available upon request through the appropriate sales or marketing contact. • Materials and/or substances not listed in the material declaration are considered not present in the product or not detectable trace levels. • In order to report full 100 percent material declaration, some materials and/or substances have been rounded to the nearest 0.1 percent. • Package material declarations are calculated using a combination of Material Safety Data Sheets (MSDS), material analysis testing, industry standard specifications and engineering calculations. Disclaimer Information ATMEL Corporation accepts no duty to notify or update users of any changes made to this document. ATMEL Corporation is not liable for any damages direct, indirect, consequential, incidental, special or otherwise suffered by users or any third party resulting from a reliance upon any information in this document that has been updated or changed.
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Following Datasheets	PDIP_24_600_Sn-1_2 (3 pages) PDIP_24_600_Sn-2_1 (3 pages) PDIP_28_300_Sn-1_2 (3 pages) PDIP_28_600_Sn-1_2 (3 pages) PDIP_32_Sn-2_1 (3 pages) PDIP_40_Sn-2 (3 pages) PDIP_8_Sn-2 (5 pages) pdn0204_1 (2 pages) pdn0313_1 (1 pages) pdn0401_1 (2 pages)
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Atmel Letterhead wdupey

Atmel Letterhead wdupey

Overview Banned Substances Material Declaration # 1 Material Declaration # 2 Comments Disclaimer Information