Specifications | Product Chemical Content Policy |
Business section |

Specifications | Product Chemical Content Policy |
Business section |
Specifications | Product Chemical Content Policy |
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Content | Reference: Product Chemical Content Policy Revision date: November 2005 Zetex Product Chemical Content Policy/ RoHS Compliance Statement In line with its published Environmental Policy, Zetex Semiconductors plc, “Zetex”, is continually striving to reduce or eliminate the usage of hazardous substances within its products and manufacturing processes. This includes full compliance with EC Directive 2002/95/EC (Restriction of the use of certain hazardous substances “RoHS”) and its amendments 2005/618/EC, 2005/717/EC and 2005/747/EC, and EC Directive 76/769/EEC (Restrictions on the marketing and use of certain dangerous substances and preparations) including its 24th amendment, 2003/11/EC. All products manufactured by Zetex after 30th April 2005 (unless ordered as Tin/Lead-plated) comply with the above Directives, and can be deemed “lead-free” within the context of the RoHS Directive. Specifically, Zetex products do not contain Lead, Mercury, Cadmium, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PDBE), Pentabromodiphenyl Ether (PentaBDE) or Octabromodiphenyl Ether (OctaBDE), above the permitted levels. In addition, Zetex products do not contain any ozone depleting substances, and ozone depleting substances are not used at any of our manufacturing locations. Through the release of this information, Zetex aims to assist customers in their evaluation of the potential environmental impact in the end of life assessment and the management of their products. However Zetex makes no warranty, representation or guarantee regarding the suitability of the information and data provided by Zetex on environmentally hazardous substances nor does Zetex assume any liability arising from the use of this information and specifically disclaims any and all consequential and incidental damages. K.Clithero Group Quality Manager This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. Europe Americas Asia Pacific Corporate Headquarters Zetex GmbH Zetex Inc Zetex (Asia) Ltd Zetex Semiconductors plc Streitfeldstraße 19 700 Veterans Memorial Highway 3701-04 Metroplaza Tower 1 Zetex Technology Park, D-81673 München Hauppauge, NY 11788 Hing Fong Road, Kwai Fong Chadderton, Oldham, OL9 9LL Germany USA Hong Kong United Kingdom Tel: (49) 89 45 49 49 0 Tel: (1) 631 360 2222 Tel: (852) 26100 611 Tel: (44) 161 622 4444 Fax: (49) 89 45 49 49 49 Fax: (1) 631 360 8222 Fax: (852) 24250 494 Fax: (44) 161 622 4446 email: europe.sales@zetex.comemail: usa.sales@zetex.comemail: asia.sales@zetex.comemail: hq@zetex.com Zetex products are distributed worldwide. For details, see http://www.zetex.com/ © 2005 Zetex Semiconductors plc Page 1 |
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Following Datasheets | PCF8523_7 (66 pages) PCIe-x4_AOC_User_Manual_2 (12 pages) PCIe-x8_AOC_User_Manual_2 (12 pages) pcimchina03pwrmosdesign (4 pages) pci_32_ds206_1 (13 pages) pci_64_ds205_1 (12 pages) PCN-1026_2 (1 pages) PCN-1027_2 (1 pages) PCN-1042_2 (2 pages) PCN-1084_2 (2 pages) |
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