SOT89PCB.vp

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Specifications	SOT89PCB.vp
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Thermalresistance(j-a)vPCBareafor FR4andSRBP(paperphenol)board material. ThermalResistance( °C /W) PCBArea(Sq.Ins.) Ther

Specifications	SOT89PCB.vp
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Content	Thermalresistance(j-a)vPCBareafor FR4andSRBP(paperphenol)board material. ThermalResistance( °C /W) PCBArea(Sq.Ins.) ThermalResistancevPCBArea 0.1 10 110 100 1000 MinimumCopper FullCopper ThermalResistance( ° C/W) 0.1 10 100 1000 110 SingleDevice On BothDevices On SingleDevice On BothDevices On MinimumCopper FullCopper PCBArea(Sq.Ins.) ThermalResistancevPCBArea SM-8 Dual (2.75W) devicesSOT223 (3W) devices Thefollowingchartsillustratehowtheboardmaterial, availableboardareaandamountofcopperpresent influencethethermalresistanceexperiencedbya transistor. Thepackagesrepresentedarethosehousinghigh performancespecificationsandwhicharelikelytobeused inapplicationswhereexcellentthermalcapabilityisan essential feature. Allofthesechartsarederivedfrommeasurementdata enablinganassessmentofmaximumjunction temperaturewithrespecttomountingmethod.In practicalcircumstances,adjacentcomponentsandthe useofmulti-layeredboardsalsotendtosignificantly reducetheactualthermalresistancepresentedto thedevice.Consequentlyavalidandconservative assessment of power capability is provided. Note: Withreferencetothecharts-“Min.Copper”referstoa minimum area device footprint. Thermal Resistance v PCB Area Comparison SOT23 SuperSOT (625mW) seriesSOT89 1W 0.0110 P.C.B.Area(Sq.Ins.) ThermalResistancevP.C.B.Area 0 150 450 ThermalResistance( ° C/W) 0.11 300 SRBPMin.Copper FR4Min.Copper SRBPMax.Copper FR4Max.Copper RthvPCBAreaComparison Thermalresistance(DegC/W)0.10 PCBArea(inchessquared) 110 100 200 MinCopper FullCopper
Following Datasheets	pccp (1 pages) PCF8523_7 (66 pages) PCIe-x4_AOC_User_Manual_2 (12 pages) PCIe-x8_AOC_User_Manual_2 (12 pages) pcimchina03pwrmosdesign (4 pages) pci_32_ds206_1 (13 pages) pci_64_ds205_1 (12 pages) PCN-1026_2 (1 pages) PCN-1027_2 (1 pages) PCN-1042_2 (2 pages)
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