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Specifications
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ferrite as shown in Figure 2. The use of different colors facilitates identification of the leads. The VSWR and overrating fa

Specifications
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Content	ferrite as shown in Figure 2. The use of different colors facilitates identification of the leads. The VSWR and overrating factor are less than 1.9 and 1.5, respectively, from 1 to 14MHz. Capacitors C26 and C27 ensure a good RF ground at the center of the primary winding. Inductor L1 keeps RF out of the power-supply line; its value is not critical. The prototype uses simple series-tuned circuits (Table 2) with Q =5 at the frequency of operation (except that the 13.56MHz inductor is used at 10 and 12MHz). Tuning is accomplished by adjusting padder C28 for maximum output power or maximum dc-input current. Other output filters or matching networks can be used provided they include a series inductor on the transformer side to prevent current from flowing at the harmonic frequencies. 4. LAYOUT The general layout of the principal components is shown in Figure 3. MOSFETs Q5 and Q6 are separated by about 0.8 inchs so that their drain leads are aligned with the leads from T1. The drivers and pre-drivers are installed roughly in line with the leads from Q5 and Q6. The prototype breadboard is constructed on a 6.5 inchs by 8 inchs piece of PC board. All wiring is done on or above the surface to simulate a PC board with traces on one side and a continuous ground plane on the other. For convenience in experimentation, U1, U2, Q1, Q2, Q3, and Q4 are socketed. Socketing is not, however, recommended for a final layout as it adds inductance between active devices. The input to U1 and U2 is high-impedance and therefore not especially critical. Chip capacitors C5, C6, C9, and C10 are installed as close as possible to the power-supply leads. A clip-on heat sink is placed over each IC to provide adequate heat dissipation. The pre driver outputs are connected to the driver inputs through short, wide (low-inductance) traces. Chip capacitors C16 and C21 are again installed as close as possible to the drain leads from Q1 and Q3. The outputs of the drivers are connected to the gates of Q5 and Q6 through short, wide traces. A clip-on heat sink is placed over each pair to provide adequate heat dissipation. The heat sink is mounted flush with the bottom of the PC board. Holes are cut for Q5 and Q6, but the integrity of the ground plane is otherwise not interrupted. Connection pads are cut near the gates and drains. The leads of Q5 and Q6 are trimmed at the point they narrow and then bent downward slightly to contact the PC board. Output transformer T1 lies flat on the PC board and is held in place adequately by its leads. Tuning elements L2 and C28 are supported on plastic L brackets. 5. PERFORMANCE Tuned Output A tuned output is used for transmitters and J1 U1 U2 R6 R10 R12 R16 R8 R14 R16 R20 Q1 Q2 Q3 Q4 Q5 Q6 C26,C27T1L1C28J2 Figure 3. General Layout of Amplifier (not to scale)
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Following Datasheets	APT9501 (13 pages) APT9502 (10 pages) APT9503 (15 pages) APT9601 (14 pages) APT9701 (10 pages) APT9702A (8 pages) APT9703 (12 pages) APT9801 (6 pages) APT9802 (8 pages) APT9803 (10 pages)
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