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Manufacturing sites. ST’s manufacturing sites are divided into two main categories: Front End and Back End. The Front E

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Content	Manufacturing sites. ST’s manufacturing sites are divided into two main categories: Front End and Back End. The Front End sites produce silicon ‘wafers’ – thin slices of silicon ranging from 5 to12 inches in diameter (the wider the diameter, the more advanced the technology required to produce it) – through a series of complex industrial processes that enable the silicon to transmit electronic signals. Back End sites assemble and package the individual silicon ‘die’ or squares by cutting them from the wafers and sealing them with wired connections into the ‘package’ or box that connects the chip to the electronic device it has been made for. Signiﬁcant events in 2003. In 2003 ST had the honor of welcoming President Jacques Chirac to open our new site in Crolles, France, where together with Motorola and Philips we have created one of the most advanced R&D centres in the world. We also developed strategic agreements, not only with our customers, which is our tradition, but also with some of our competitors: with TSMC in Crolles, with Texas Instruments to develop common chipsets in the mobile telecommunications area, and with Hynix to develop NAND ﬂash memories. During 2003, ST completed some signiﬁcant acquisitions: Proton World International (leading smart card software company established in Belgium); Tioga Technologies (based in Israel) to strengthen our position in the area of digital subscriber line technology; Incard (based in Italy) to increase our ability to offer solutions in the smart card area; Synad Technologies (a wireless-LAN chip developer based in the UK). In 2003 we announced our intention to reconsider and optimize our 6-inch manufacturing facilities worldwide (see ‘Closure of our manufacturing site at Rennes’ in the section ‘Our People’ for details). Additional information about. STMicroelectronics. According to the most recent data from independent sources, ST is the world’s leading supplier of analog Integrated Circuits (ICs), MPEG-2 decoder ICs, and ASICs/ASSPs overall. In the memory market, ST is ranked fourth in NOR Flash ICs. In application segments, ST is number one for ICs in set-top boxes; number two in smart cards, in hard disk drives, and on xDSL chips; and number three in wireless semiconductors and automotive. The company currently offers over 3,000 main types of products to more than 1,500 customers, including Alcatel, Bosch, DaimlerChrysler, Ford, Hewlett-Packard, IBM, Motorola, Nokia, Nortel Networks, Philips, Seagate Technology, Siemens, Sony, Thomson and Western Digital. Nearly 70% of our revenues derive from differentiated products, a combination of dedicated, semi-tailored, programmable products designed to suit a speciﬁc customer or a speciﬁc application. These products have a high ‘system’ content and reﬂect the emphasis we put on ‘System-on-Chip’ technology, which responds to the fast-growing market for ‘convergence’ products. Front End Agrate, Italy Ang Mo Kio, Singapore Carrollton, Texas USA Castelletto, Italy Catania, Italy Crolles, France Phoenix, Arizona USA Rennes, France (undergoing closure) Rousset, France Tours, France Back End Ain Sebâa, Morocco Bouskoura, Morocco Bouskoura 2000, Morocco Kirkop, Malta Muar, Malaysia Shenzhen, China Toa Payoh, Singapore Tuas, Singapore ST has 10 Front End and 8 Back End sites: 10
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