| Specifications | 20_plcc_pb-free_c_customer_format.xls |
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| Specifications | 20_plcc_pb-free_c_customer_format.xls |
| Business section |
| Specifications | 20_plcc_pb-free_c_customer_format.xls |
| Suggested Link Details/Purchase | |
| Content | 5555 NE Moore Ct. Hillsboro OR 97124 Package: with Matte Sn Plating (503) 268-8000 Total Device Weight 0.70 Grams August, 2008 % of Total Pkg. Wt. Weight (g) % of Total Pkg. Wt. Weight (g)SubstanceCAS #Notes / Assumptions: Die 0.46% 0.003Silicon chip7440-21-3Die size: 1.63 x 1.68 mm Mold 83.52% 0.585 Mold Compound Density between 1.7 and 2.1 grams/cc 73.24%0.513 Silica Fused60676-86-075 to 95% Silica Fused (LSC uses 87.7% in our calculation) 4.18%0.029 Epoxy Resin-2 to 8% Epoxy Resin (LSC uses 5% in our calculation). 4.18%0.029 Phenol Resin-3 to 8% Phenol Resin (LSC uses 5% in our calculation). 1.67%0.012 Epoxy Cresol Novolac9003-35-40 to 3% Epoxy Cresol Novolac (LSC uses 2% in our calculation). 0.25%0.002 Carbon black1333-86-40.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation) D/A E poxy 0.04% 0.0003 Die attach epoxy Density: 4 grams/cc 0.03%0.0002 Silver (Ag)7440-22-4Silver content: 60-100% (LSC uses 80% in our calculation) 0.01%0.0001 other- Wire 0.08% 0.0006Gold (Au)7440-57-5 1.00 mil diameter; 1 wire per package lead; wire length 3 mm Lead Plating 0.64%0.004Tin (Sn)7440-31-5 Plating is 100% Sn; thickness is >10.2um Leadframe15.26% 0.107 Leadframe thickness is nominal (per Case Outline) 15.033%0.105 Copper (Cu) 7440-50-8 Cu (LSC uses 98.5% in our calculation) 0.191%0.0013 Iron (Fe) 7439-89-6 0 to 2.35% Fe (LSC uses 1.25% in our calculation) 0.005%0.00003 Phosphorus (P) 7723-14-0 0 to 0.07% P (LSC uses 0.03% in our calculation) 0.021%0.00015 Zinc (Zn) 7440-66-6 0.12 to 0.15% Zn (LSC uses 0.14% in our calculation) 0.012%0.00009 Zirconium (Zr)7440-67-70 to 0.15% Zr (LSC uses 0.08% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Device Material Content 20 PLCC |
| Following Datasheets | 21-1_1 (2 pages) 21-2 (1 pages) 211_1 (2 pages) 21130 (16 pages) 211627_LT3355_ASB_2011_Full_Book_LR-1 (212 pages) 21178 (502 pages) 2118009B_20090407_Manchester (3 pages) 211D70FF-D68A-4D15-BD2A-C5881E7F2E13 (2 pages) 212 (3 pages) 21212 (17 pages) |
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