20_pdip_d_customer

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Specifications	20_pdip_d_customer_format.xls
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5555 NE Moore Ct. Hillsboro OR 97124 Package: with SnPb Plating (503) 268-8000 Total Device Weight 1.34 Grams August, 2008 %

Specifications	20_pdip_d_customer_format.xls
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Content	5555 NE Moore Ct. Hillsboro OR 97124 Package: with SnPb Plating (503) 268-8000 Total Device Weight 1.34 Grams August, 2008 % of Total Pkg. Wt. Weight (g) % of Total Pkg. Wt. Weight (g) SubstanceCAS #Notes / Assumptions: Die 0.70% 0.009Silicon chip7440-21-3Die size: 3.0 x 2.7 x 0.50 mm. Mold 69.93% 0.937 Mold Compound Density between 1.7 and 1.9 grams/cc 59.93%0.803 Silica Fused60676-86-075 to 95% Silica Fused (LSC uses 85.7% in our calculation) 4.20%0.056 Epoxy Resin-2 to 8% Epoxy Resin (LSC uses 6% in our calculation). 4.20%0.056 Phenol Resin-2 to 8% Phenol Resin (LSC uses 6% in our calculation) 1.40%0.019 Epoxy, Cresol Novolac29690-82-21 to 3% Cresol Novolac Epoxy (LSC uses 2% in our calculation). 0.21%0.003 Carbon black1333-86-40.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation) D/A Epoxy 0.06% 0.001Silver-filled Epoxy 0.05%0.0007Silver (Ag) 7440-22-4Die attach epoxy Density: 4 grams/cc 0.01%0.0002other -(silver content: 60-100%; LSC uses 80% in our calculation) Wire 0.06%0.001Gold (Au)7440-57-5 1.2 mil wire diameter; 1 wire for each package lead; wire length 3 mm Lead Plating2.20% 0.030 1.87%0.025Tin (Sn)7440-31-5 Nominal: 85% Sn, 15% Pb 0.33%0.004Lead (Pb)7439-92-1 Thickness is 0.015mm Leadframe27.03% 0.362 Leadframe thickness is nominal (per Case Outline). 26.35%0.353Copper (Cu)7440-50-8 97.46% Cu 0.64%0.009Iron (Fe)7439-89-6 2.35% Fe 0.03%0.0004Zinc (Zn)7440-66-6 0.12% Zn 0.02%0.0003Phosphorus (P)7723-14-0 0.07% P Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Device Material Content 20 PDIP
Following Datasheets	20_pdip_pb-free (1 pages) 20_plcc (1 pages) 20_plcc_pb-free (1 pages) 21-1_1 (2 pages) 21-2 (1 pages) 211_1 (2 pages) 21130 (16 pages) 211627_LT3355_ASB_2011_Full_Book_LR-1 (212 pages) 21178 (502 pages) 2118009B_20090407_Manchester (3 pages)
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20_pdip_d_customer_format.xls

20_pdip_d_customer_format.xls