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5555 NE Moore Ct. Hillsboro OR 97124 Package: with SnPb Plating (503) 268-8000 Total Device Weight 5.70 Grams MSL: 3 custreq@

Specifications
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Content	5555 NE Moore Ct. Hillsboro OR 97124 Package: with SnPb Plating (503) 268-8000 Total Device Weight 5.70 Grams MSL: 3 custreq@lscc.com Peak Reflow Temp: 225°C August, 2008 % of Total Pkg. Wt. Weight (g) % of Total Pkg. Wt. Weight (g) SubstanceCAS #Notes / Assumptions: Die 1.79% 0.102Silicon chip7440-21-3Die size: 7.4 x 9.3 mm Mold 89.33% 5.092 Mold Compound Density varies between 1.7 and 2.3 grams/cc 78.34%4.465 Silica Fused60676-86-075 to 95% Silica Fused (LSC uses 87.7% in our calculation) 6.25%0.356 Epoxy Resin-4 to 10% Epoxy Resin (LSC uses 7% in our calculation). 4.47%0.255 Phenol Resin-2 to 8% Phenol Resin (LSC uses 5% in our calculation). 0.27%0.015 Carbon black1333-86-40.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation) D/A Epoxy 0.12% 0.007Silver-filled Epoxy 0.10%0.006 Silver (Ag)7440-22-4Die attach epoxy Density: 4 grams/cc 0.02%0.001 other-(silver content: 70-90%; LSC uses 80% in our calculation) Wire 0.11%0.006Gold (Au)7440-57-5 1.0 mil wire diameter; 1 wire for each package lead; wire length 3 m m Lead Plating0.56% 0.032 0.47%0.027Tin (Sn)7440-31-5 Nominal: 85% Sn, 15% Pb 0.08%0.005Lead (Pb)7439-92-1 Thickness is 0.015mm Leadframe8.10% 0.462 Leadframe thickness is nominal (per Case Outline) 7.79%0.444Copper (Cu)7440-50-8 96.2% Cu 0.24%0.0138 Nickel (Ni) 7440-02-0 3.0% Ni 0.05%0.003Silicon (Si)7440-21-3 0.65% Si 0.01%0.0007 Magnesium (Mg) 7439-95-4 0.15% Mg Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B1 Device Material Content 208 PQFP
Following Datasheets	208_pqfp_pb-free_a_customer_format (1 pages) 209-210 (2 pages) 209101_2011_02_24_FY_2010_annualreport_en-1 (152 pages) 209153_Structural_Bonding_Hidden_Costs_of_Instant_Assembly_Henkel_Buckley_2010-1 (7 pages) 2096 (12 pages) 2096v (11 pages) 2096ve (13 pages) 2096vl (11 pages) 209ce598-b279-4102-bb88-e7cefa29b57e (1 pages) 20ac79ba-16f5-4853-948f-f71c563c5232 (2 pages)
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