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5555 NE Moore Ct. Hillsboro OR 97124 Package: with SnPb Solder Balls (503) 268-8000 Total Device Weight 0.79 Grams MSL: 3 cus

Specifications
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Content	5555 NE Moore Ct. Hillsboro OR 97124 Package: with SnPb Solder Balls (503) 268-8000 Total Device Weight 0.79 Grams MSL: 3 custreq@lscc.com Peak Reflow Temp: 225°C November, 2009 % of Total Pkg. Wt. Weight (g) % of Total Pkg. Wt. Weight (g) SubstanceCAS #Notes / Assumptions: Die 2.50% 0.0197 Silicon chip7440-21-3 Die size: 5.05 x 4.41 m m Mold 37.02% 0.292 Mold Compound composition: 29.06%0.229 Silica (Fused or Amorphous)60676-86-065 to 95% Silica (LSC uses 78.5% in our calculation) 5.18%0.0409 Epoxy/Phenol Resin-5 to 22% Epoxy/Phenol Resin (LSC uses 14% in our calculation) 0.37%0.0029 Brominated Epoxy Resin68928-70-10 to 2% Brominated Epoxy Resin (LSC uses 1% in our calculation) 0.93%0.0073 Antimony Trioxide1309-64-40 to 5% Antimony Trioxide (LSC uses 2.5% in our calculation) 0.37%0.0029 Antimony Pentoxide1314-60-90 to 1.5% Antimony Pentoxide (LSC uses 1% in our calculation) 0.93%0.0073 Siloxanes-0 to 5% Siloxanes (LSC uses 2.5% in our calculation) 0.19%0.0015 Carbon Black1333-86-40 to 1% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density ranges between 1.8 and 2.1 grams/cc D/A Epoxy 0.29% 0.0023 Die attach epoxy Density: 4 grams/cc 0.23%0.0018 Silver (Ag)7440-22-460 to 100% Silver (LSC uses 80% in our calculation) 0.06%0.0005 Organic esters and resins-0 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) Wire 0.77% 0.0061 Gold (Au)7440-57-5 0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm Solder Balls 30.38%0.2397 19.14%0.1510 Tin (Sn)7440-31-5 Solder ball composition Sn63/Pb37 11.24%0.0887 Lead (Pb)7439-92-1 Substrate22.77% 0.1796 15.48%0.1222 Glass fiber65997-17-360 to 75% glass fiber (LSC uses 68% in our calculation) 7.29%0.0575 BT Resins- Foil6.27% 0.0495 Copper (Cu)7440-50-8 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B4 Device Material Content 208 fpBGA
Following Datasheets	208_fpbga_pb-free_customer_format (1 pages) 208_pqfp_a_customer_format_cas (1 pages) 208_pqfp_pb-free_a_customer_format (1 pages) 209-210 (2 pages) 209101_2011_02_24_FY_2010_annualreport_en-1 (152 pages) 209153_Structural_Bonding_Hidden_Costs_of_Instant_Assembly_Henkel_Buckley_2010-1 (7 pages) 2096 (12 pages) 2096v (11 pages) 2096ve (13 pages) 2096vl (11 pages)
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