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Specifications
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1 1600 Golf Rd., Rolling Meadows, IL 60008 • 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-75

Specifications
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Content	1 1600 Golf Rd., Rolling Meadows, IL 60008 • 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com SERIES SPECIFICATIONS Wattage 1 Oper. Voltage (V) Resistance TCR2 VCR2 Series Type P70 (mW) std. untrimmed (≥5%) Range Tolerance (ppm) (ppm) HVC0805- 0805 125 200 600 100K-100M 0.5-10% 25, 50, 100 50 >100M-1G 2-20% 50, 100, 250 250 >1G-10G 5-20% 100, 250 500 >10G-100G 10-30% 1000, 2000 1000 HVC1206- 1206 250 600 1000 100K-100M 0.5-10% 25, 50, 100 50 >100M-1G 2-20% 50, 100, 250 100 >1G-10G 5-20% 100, 250 250 >10G-100G 10-30% 500, 1000 1000 HVC2512- 2512 1000 2000 3000 100K-100M 0.5-10% 25, 50, 100 10 >100M-1G 1-20% 25, 50, 100 25 >1G-10G 2-20% 50, 100 100 >10G-100G 5-30% 250, 500 250 1. At continuous power dissipation the dimensions of the solder pads have to be capable of sufficient heat conduction. 2. Not all TCR/VCR combinations available in all resistance values CHARACTERISTICS Operating temperature range -55°C ~ +155°C Climatic category55/155/56, acc. to EN 60068-1 Solderability250°C, 3s, acc. to EN 60068-2-58 Max. soldering temperature260°C, 10s, acc. to IEC 68-2-58 Long Term Stability <1G <10G ≥1G Load Life 70°C/1000h <0.25% <0.5% <1% Storage 125°C/1000h <0.5% <1% <2% Max. Voltage/1000h <0.5% <1% <2% Data not specified according to EN 140401-802 (CECC 40401-802) HIGH VOLTAGE THICK FILM SMD HVC Series Precision High-Value High-voltage Wraparound Chip FEATURES • High value chip resistors in thick film technology • Low temperature and voltage dependency (low TCR and VCR) • High working voltage up to 3000V • Suitable for high vacuum applications—no organics • Contact areas: Nickel-barrier/matte tin • Wraparound terminals 100 Percent Rated Power Ambient Temperature, °C 60 20 0 80 40 05010015570-55 Derating TERMINAL DETAILS Base MetalPtAg Termination Finish100% electroplated matte Sn100 Thickness of Finish5 microns Barrier Material between Base Metal and FinishPorosity-free Ni (5-8 microns thickness) Baking/Annealing Process after Sn Plating150°C; > 4 hours Peak Process Body Temperature (Classification Temperature) and Maximum Time 260°C for 10 seconds
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Following Datasheets	HVD_press_release (1 pages) hvflier (2 pages) HVSC_WEB_BROCHURE_REV_A (4 pages) hv_fall92 (8 pages) hws-p (2 pages) hws (2 pages) hws1500 (2 pages) hws1800t (2 pages) hws_hd (2 pages) hws_me (2 pages)
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