HV MDM Nas Hashemian

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Specifications	HV MDM Nas Hashemian
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Interconnect Solutions www.ittcannon.com Mixed Signal HV MDM Interconnect October 2008 APPLICATION NOTE The Challenge Initial

Specifications	HV MDM Nas Hashemian
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Content	Interconnect Solutions www.ittcannon.com Mixed Signal HV MDM Interconnect October 2008 APPLICATION NOTE The Challenge Initially developed by ITT-ICS for high density packaging in harsh environments, the MDM micro series of connectors have been successfully used in many Aerospace applications. Aerospace Customers challenged ITT to develop a high density mixed signal connector capable of carrying high voltage signals along with low voltage signals within the same package. In addition, the new interconnect had to be able to prevent arcing between contacts. MDM High Temperature Interconnect Assembly The ITT Solution … ITT Interconnect Solutions Cannon designed the high voltage MDM series by designing an integrated high voltage contact system with isolation towers and a silicone sealing method to accommodate multiple voltage outputs. The turnkey solution allows for the utilization of advanced materials which prevent electrical arching at high altitude conditions. Product Features • Complete turnkey interconnect configuration • MDM connector with HV contacts • 2000 VDC • Twist Pin Contact system for LV signals • Crimped gold plated contacts • Combination of 0.050 & 0.100 spacing • Integrated silicone towers • Straight board mount receptacle For application assistance, please contact: AMERICAS Barry Cambeilh, +1.714.628.8218, barry.cambeilh@itt.com EUROPE Nick Lewis, 44 (0) 1256 311 993, nick.lewis@uk.itt.com Applications • Avionics systems • Commercial Aircraft Systems • Launch Vehicle systems • Radar Systems
Following Datasheets	HV44A_manual (2 pages) HVAC_Tools (4 pages) HVACSolutions (2 pages) hvc_1 (2 pages) HVD_press_release (1 pages) hvflier (2 pages) HVSC_WEB_BROCHURE_REV_A (4 pages) hv_fall92 (8 pages) hws-p (2 pages) hws (2 pages)
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